| PART |
Description |
Maker |
| PC1-1CB |
HEAT DISSIPATORS FOR PLASTIC CASE, CASE-MOUNTED SEMICONDUCTORS
|
List of Unclassifed Manufac...
|
| SGB06N60 SGD06N60 SGP06N60 Q67040-S4450 SGU06N60 Q |
Heat Sink; Package/Case:TO-220; Thermal Resistance:13.4 C/W; Mounting Type:Through Hole; Length:25.4mm; Height:12.7mm; Width:34.92mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
Fast IGBT in NPT-technology
IGBTs & DuoPacks - 6A 600V TO263AB SMD IGBT
IGBTs & DuoPacks - 6A 600V TO252AA SMD IGBT
IGBTs & DuoPacks - 6A 600V TO220AB IGBT
|
INFINEON[Infineon Technologies AG]
|
| PALLV16V8-10SC PALLV16V8-10PC PALLV16V8-10JC |
EE PLD, 12 ns, PDSO20 PLASTIC, SOP-20
EE PLD, 12 ns, PDIP20 PLASTIC, DIP-20
EE PLD, 12 ns, PQCC20 PLASTIC, LCC-20
|
Advanced Micro Devices, Inc.
|
| P5Z22V10-7D-T P5Z22V10-7DH-T P5Z22V10-7A-T |
EE PLD, 7.5 ns, PDSO24 7.50 MM, PLASTIC, MS-013AD, SOP-24
EE PLD, 7.5 ns, PDSO24 4.40 MM, PLASTIC, MO-153AD, TSSOP-24
EE PLD, 7.5 ns, PQCC28 PLASTIC, MO-047AB, LCC-28
|
Xilinx, Inc.
|
| ATS-19G-117-C1-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-19G-02-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| S30AG250KY1234 |
HEAT SINKS AND STANDOFFS
|
Dielectric Laboratories, Inc.
|
| ATS-19G-121-C1-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| HFC-100 |
HEAT FLUX CONTROLLER
|
Advanced Thermal Soluti...
|
| ATUM-XX |
HEAT SHRINK BLK 1.2M
|
Tyco Electronics
|
